姓 名 | 王桂莲 | 性 别 | 女 | |
职 称 | 副教授 | |||
研究方向 | MEMS传感器, 微电子封装,有限元分析,多目标优化等 | |||
通讯地址 | 上海市松江区龙腾路333号行政楼808室 | |||
邮政编码 | 201620 | |||
联系电话 | 021-67791084 | |||
电子邮箱 | wglwrc2016@126.com | |||
个 人 介 绍 | 王桂莲,毕业于上海交通大学,现于上海工程技术大学电子信息系从事教学和科研工作。主持国家自然基金青年项目1项,横向课题3项,参与国家重大项目1项、国家自然科学基金面上项目1项,在Advanced Materials、Small等国际顶级期刊发布高水平论文30余篇,其中以第一作者发布的SCI 9篇,高被引ESI论文1篇,发明专利授权4项。
主要研究成果: [1] Guilian Wang, Guifu Ding, Rui Liu, Dongdong Xie, Yongjin Wu, Xiaodan Miao.Multi-objective optimization of a bidirectional-ribbed microchannel based on CFD and NSGA-II genetic algorithm. International Journal of Thermal Sciences, 181 (2022) 107731. (SCI收录) [2] Guilian Wang, Tao Chen, Mingfei Tian. Fluid and heat transfer characteristics of microchannel heat sink with truncated rib on sidewall. International Journal of Heat and Mass Transfer, Vol. 148, 119142, 2020. (SCI二区收录) [3]Guilian Wang, Qian Nan, Guifu Ding, Heat transfer enhancement in microchannel heat sink with bidirectional rib,International Journal of Heat and Mass Transfer,Vol. 136, 597-609, 2019. (SCI二区收录,高被引论文) [4]Guilian Wang, C, Rui Liu, Jiangbo Luo, Di Niu, Junhong Zhao, Xiaolin Zhao and Yan Wang. Design, simulation and fabrication of a flexible bond pad (FBP) with hollow annular protuberance to improve the thermal fatigue lifetime for Through Silicon Vias (TSVs), Journal of Micromechanics and Microengineering, Vol. 24, 125078, 2014. (SCI收录) [5] Guilian Wang, Di Niu, Fuqiang Xie, Yan Wang, Xiaolin Zhao and Guifu Ding. Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling, Applied Thermal Engineering, Vol. 85, pp. 61-70, 2015. (SCI二区收录) [6] Guilian Wang, Guifu Ding and Xiaodan Miao. On-resistance reduction of vertical double diffusion metal oxide semiconductor devices with external stress, Micro Nano Letter, 2016 (SCI收录) |